SEEYALABS Co., Ltd.

세계최고의 기술과 제품 끊임없는 기술개발 향상으로 고객만족을 위해 노력을 하겠습니다.

  • BUSINESS
  • OEM/ODM R&D
  • 01
    Design capability

    • Having an experience in developing and mass-producing camera modules by application
      (ADAS Sensing, SVM & RVM Viwing, DMS, E-Mirror, In-Cabin)

    • Experience in designing and developing optimization mechanisms for material and shape for reliability, Ability to analyze optical properties

    • Experience in optimization circuit/PCB/system development for reducing costs and respond to customer reliability requirements

    • Manufacturing process reflecting cost reduction and productivity improvement Have design experience

  • 02
    Analytical ability

    • Heat Characteristics Analysis

    • Electrical characteristics analysis and evaluation
      (booting, power consumption)

    • Analysis and improvement of AA facility design and optical performance (MTF, distortion)

    • Image Evaluation and Analysis
      (MTF, Distortion Parameters)

  • 03
    Verification capability

    • Design validation
      (circuit, 3D modeling, prototyping and validation, process and facility validation)

    • Product performance verification
      (noise, EMC, heat generation, image (optical) evaluation)

    • Reliability verification
      (customer requirements such as high temperature and high humidity, thermal shock, temperature and humidity cycle, malice evaluation, etc.)